Hidemi Ozawa

Title: The Innovations of Hidemi Ozawa

Introduction

Hidemi Ozawa is a notable inventor based in Yamato, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and size of semiconductor devices.

Latest Patents

Ozawa's latest patents include innovative techniques for semiconductor devices. One of his patents describes a method that allows for the production of a semiconductor device with a chip that is smaller in external size than conventional chips, without compromising production yield. This device features a substrate with a square-shaped plane and interconnections formed on its first surface. The semiconductor chip is mounted on this substrate and includes electrodes for circuit formation. Additionally, a conductive wire connects the chip's electrode to the substrate's interconnection, which has connecting pads arranged from the peripheral side toward the inner side.

Another patent by Ozawa focuses on a semiconductor device that has a shortened wiring length, further reducing the size of the chip while maintaining production efficiency. This invention also utilizes a substrate with a square-shaped plane and similar interconnection features, showcasing his commitment to advancing semiconductor technology.

Career Highlights

Throughout his career, Hidemi Ozawa has worked with prominent companies, including Hitachi, Ltd. His experience in these organizations has contributed to his expertise in semiconductor innovations.

Collaborations

Ozawa has collaborated with various professionals in his field, including Tsugihiko Hirano, who has been a significant coworker in his projects.

Conclusion

Hidemi Ozawa's contributions to semiconductor technology through his patents demonstrate his innovative spirit and dedication to advancing the industry. His work continues to influence the development of smaller and more efficient semiconductor devices.