Tokyo, Japan

Hidekuni Takano

This inventor holds 1 USPTO granted patent. Top assignee: 3M Innovative Properties Company. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hidekuni Takano. Retrieved from https://idiyas.com/inventor/hidekuni-takano-c7wbrxsc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Hidekuni Takano

Introduction

Hidekuni Takano is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of innovative materials, particularly through his patented inventions. His work reflects a commitment to enhancing everyday products for improved functionality and user experience.

Latest Patents

One of Takano's most recent patents is for a flat wound tape article and method. This invention features a flat core with tape wound around it. The design is specifically configured to protect the edges of the tape from adhering to dirt, dust, and lint, while maintaining a convenient shape for use. This innovation showcases Takano's ability to address practical challenges in product design.

Career Highlights

Takano is associated with 3M Innovative Properties Company, where he continues to develop and refine his inventions. His work at 3M has allowed him to collaborate with other talented professionals in the field, contributing to the company's reputation for innovation.

Collaborations

Some of Takano's coworkers include Yasuo Sudo and Keiichiro Horikoshi. Their collaborative efforts have likely played a role in advancing the innovative projects at 3M.

Conclusion

Hidekuni Takano's contributions to the field of innovation, particularly through his patent for a flat wound tape article, highlight his expertise and commitment to improving product design. His work continues to influence the industry and enhance user experiences.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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