Tokushima, Japan

Hidekimi Yamamoto


Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 55(Granted Patents)


Location History:

  • Itano-gun, JP (2000)
  • Tokushima-ken, JP (2000)
  • Tokushima, JP (1997 - 2003)

Company Filing History:


Years Active: 1997-2003

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9 patents (USPTO):Explore Patents

Title: Innovations of Hidekimi Yamamoto

Introduction

Hidekimi Yamamoto is a notable inventor based in Tokushima, Japan. He has made significant contributions to the field of packaging technology, holding a total of nine patents. His work focuses on enhancing the efficiency and accuracy of packaging systems.

Latest Patents

Among his latest innovations is a web position matching system. This system is designed to match marks on a web of packaging material with a reference position. It utilizes a sensor device to detect any displacement of the mark from the reference position. The system includes a setting device that adjusts the feed amount based on the detected displacement. Another significant patent is the container feeder, which facilitates the feeding of pillow-like uncompleted containers into a conveyor for further processing. This device employs a slanting chute and movable receiving members to ensure smooth handling of the containers.

Career Highlights

Yamamoto's career is marked by his dedication to improving packaging processes. His inventions have streamlined operations in the industry, making them more efficient and reliable. His work at Shikoku Kakoki Co., Ltd. has been instrumental in advancing the company's technological capabilities.

Collaborations

Yamamoto has collaborated with several talented individuals in his field, including Michio Ueda and Akimasa Fujimoto. These partnerships have fostered innovation and contributed to the development of new technologies in packaging.

Conclusion

Hidekimi Yamamoto's contributions to packaging technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the efficiency of packaging systems today.

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