Hideki Shirota

Title: Innovations by Hideki Shirota in Electroplating Technology

Introduction

Hideki Shirota is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of electroplating, particularly in the application of non-conductive plastic molded products. His innovative methods have paved the way for advancements in manufacturing processes.

Latest Patents

Shirota holds a patent for a method of electroplating non-conductive plastic molded products. This method involves several key steps, including the application of a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound. Following this, an electrically conductive coating is formed on the surface of the moldings using an electroless copper plating solution. This solution contains a copper compound, a saccharide with reducing properties, a complexing agent, and an alkali metal hydroxide. Finally, the coated moldings undergo electroplating. This method allows for the formation of an electroplated coating that is excellent in both appearance and properties, achieved through a simple procedure.

Career Highlights

Shirota is associated with Okuno Chemical Industries Co., Ltd., where he has been instrumental in developing innovative electroplating techniques. His work has contributed to enhancing the quality and efficiency of plastic molding processes.

Collaborations

One of his notable collaborators is Jun Okada, with whom he has worked closely to advance their research and development efforts in electroplating technology.

Conclusion

Hideki Shirota's contributions to the field of electroplating, particularly with non-conductive plastic molded products, demonstrate his innovative spirit and commitment to advancing manufacturing techniques. His patent reflects a significant step forward in the industry, showcasing the potential for improved processes and products.