The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2001
Filed:
Nov. 20, 1998
Hideki Shirota, Kyoto, JP;
Jun Okada, Osaka, JP;
Okuno Chemical Industries Co., Ltd., Osaka, JP;
Abstract
A method of electroplating non-conductive plastic moldings, the method comprising the steps of: applying a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound; forming an electrically conductive coating on the surface of the moldings using an electroless copper plating solution containing a copper compound, a saccharide having a reducing property, a complexing agent and an alkali metal hydroxide; and electroplating the coated moldings. According to the method, an electroplated coating excellent in appearance and properties can be formed on non-conductive plastic moldings by a simple procedure.