This inventor holds 1 USPTO granted patent. Top assignee: Fujitsu Corporation. Active years: 2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2000
Title: Innovations by Hideki Ota
Introduction
Hideki Ota is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for forming bumps on semiconductor wafers.
Latest Patents
One of Hideki Ota's key patents is titled "Method for forming bumps using dummy wafer." This patent describes a method that includes the steps of forming bumps on a dummy wafer. The dummy wafer is then diced into dummy chips, and the bumps formed on these chips are inspected. This process ensures that only good bumps are transferred to a real chip on which circuit patterns are formed. Ota holds 1 patent for this innovative method.
Career Highlights
Hideki Ota is associated with Fujitsu Corporation, a leading company in the technology sector. His work at Fujitsu has allowed him to explore and implement advanced semiconductor technologies. His contributions have been instrumental in enhancing the efficiency and reliability of semiconductor manufacturing processes.
Collaborations
Throughout his career, Hideki Ota has collaborated with esteemed colleagues such as Kiyotaka Seyama and Yasuhiro Usui. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
In summary, Hideki Ota is a prominent inventor whose work in semiconductor technology has led to significant advancements. His innovative methods continue to influence the industry and pave the way for future developments.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile