This inventor holds 1 USPTO granted patent. Top assignee: Tokuyama Corporation. Active years: 1997.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1997
Title: Innovations by Hideki Okoshi
Introduction
Hideki Okoshi is a notable inventor based in Tokuyama, Japan. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the performance and reliability of semiconductor devices.
Latest Patents
One of Hideki Okoshi's key patents is for a package designed for mounting a semiconductor device. This package comprises a base plate and a conductive layer that is laminated onto the base plate via an adhesive layer. Notably, the modulus of elasticity at 25°C of the adhesive layer is 10 kg/mm² or less. This innovation is crucial for improving the efficiency and durability of semiconductor applications.
Career Highlights
Hideki Okoshi is associated with Tokuyama Corporation, where he has been instrumental in advancing semiconductor packaging technologies. His expertise and innovative mindset have positioned him as a valuable asset to the company. With a patent portfolio that includes 1 patent, he continues to contribute to the field.
Collaborations
Throughout his career, Hideki has collaborated with talented individuals such as Tokio Okoshi and Yuka Kato. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
In summary, Hideki Okoshi is a prominent inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative solutions and collaborations continue to drive advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile