This inventor holds 1 USPTO granted patent. Top assignees: Osaka Diamond Industrial Co., Sumitomo Electric Industries, Limited. Active years: 2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 14 
1 out of 10,641 
Years Active: 2000
Title: The Innovations of Hideki Ogawa
Introduction
Hideki Ogawa is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of manufacturing, particularly with his innovative patent related to wire-saw technology. His work has had a lasting impact on the industry.
Latest Patents
Ogawa holds a patent for a wire-saw and its manufacturing method. This invention showcases his expertise and creativity in developing tools that enhance manufacturing processes. He has 1 patent to his name, reflecting his dedication to innovation.
Career Highlights
Throughout his career, Hideki Ogawa has worked with prominent companies such as Sumitomo Electric Industries, Limited and Osaka Diamond Industrial Co. His experience in these organizations has allowed him to refine his skills and contribute to various projects.
Collaborations
Ogawa has collaborated with talented individuals in his field, including Hideo Oshita and Masaaki Yamanaka. These partnerships have fostered a creative environment that has led to advancements in technology and manufacturing.
Conclusion
Hideki Ogawa's contributions to the field of manufacturing through his innovative patent and collaborations with esteemed colleagues highlight his importance as an inventor. His work continues to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile