Nagoya, Japan

Hideki Moriyama


Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2002-2007

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3 patents (USPTO):Explore Patents

Title: Innovations of Hideki Moriyama

Introduction

Hideki Moriyama is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of materials science, particularly in the development of electrically conductive polyimide compositions.

Latest Patents

Moriyama holds three patents, with his latest inventions focusing on advanced polyimide films. One of his notable patents is for electrically conductive polyimide compositions that incorporate a carbon nanotube filler. This invention aims to achieve a surface resistivity ranging from 50 ohm/square to 1.0×10 ohms/square. The electrically conductive polyimides developed by Moriyama exhibit an excellent balance of properties compared to conventional polyimides with conductive fillers, largely due to factors such as the film's water content, degree of imidization, and polymer orientation. Another significant patent involves laminate-type materials designed for flexible circuits. This laminate demonstrates improved resistance to separation failure when integrated into flexible circuit structures. It is composed of a highly bondable polyimide formed from a polyamic acid that includes a tetracarboxylic acid component, a diamine component, and a small percentage of a dicarboxylic acid component. The adhesive strength of this laminate exceeds 10 N/cm, and preferably greater than 19 N/cm.

Career Highlights

Throughout his career, Moriyama has worked with prominent companies such as Du Pont Toray Company Limited and E.I. DuPont De Nemours and Company. His experience in these organizations has contributed to his expertise in materials development and innovation.

Collaborations

Moriyama has collaborated with notable colleagues, including Kenji Uhara and Meredith L. Dunbar. These partnerships have likely enhanced his research and development efforts in the field of conductive materials.

Conclusion

Hideki Moriyama's contributions to the field of electrically conductive polyimide compositions highlight his innovative spirit and dedication to advancing materials science. His patents reflect a commitment to improving the performance and reliability of flexible circuit technologies.

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