The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
May. 17, 2002
Hideki Moriyama, Nagoya, JP;
Kenji Uhara, Aich, JP;
Meredith L. Dunbar, Canal, OH (US);
James R. Edman, Circleville, OH (US);
Hideki Moriyama, Nagoya, JP;
Kenji Uhara, Aich, JP;
Meredith L. Dunbar, Canal, OH (US);
James R. Edman, Circleville, OH (US);
E. I. du Pont de Nemours and Company, Wilmington, DE (US);
DuPont Toray Co. Ltd., Tokyo, JP;
Abstract
A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.