Yokohama, Japan

Hideki Masuyama

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Kashima Engineering Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Masuyama. Retrieved from https://idiyas.com/inventor/hideki-masuyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations of Hideki Masuyama

Introduction

Hideki Masuyama is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of engineering, particularly in the development of innovative apparatuses for industrial applications. His work focuses on enhancing efficiency and effectiveness in various processes.

Latest Patents

Masuyama holds a patent for a particle packing apparatus. This invention provides a solution for uniformly packing particles, such as catalysts, without damaging them. The apparatus includes a base that remains fixed relative to the vessel, a distributor that is rotationally symmetrical to a central axis, and a motor that rotates the distributor. This design ensures that particles are supplied and distributed effectively, enhancing the packing process.

Career Highlights

Masuyama is associated with Kashima Engineering Co., Ltd., where he applies his expertise in engineering and innovation. His work at the company has contributed to advancements in technology and industrial processes. His dedication to improving engineering solutions has made him a respected figure in his field.

Conclusion

Hideki Masuyama's contributions to the field of engineering, particularly through his patented particle packing apparatus, demonstrate his commitment to innovation. His work continues to influence industrial practices and improve efficiency in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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