Tokyo, Japan

Hideki Hosada

This inventor holds 1 USPTO granted patent. Top assignees: Tanaka Kikinzoku Kogyo K.k., Tokyo Institute of Technology. Active years: 2020.


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Innovations of Hideki Hosada

Introduction

Hideki Hosada is a notable inventor based in Tokyo, Japan. He is recognized for his contributions to the field of materials science, particularly in the development of superelastic alloys. His innovative work has implications in various industries, especially in the medical field.

Latest Patents

Hideki Hosada holds a patent for a superelastic alloy. This alloy is formed by the addition of Fe or Co to an Au—Cu—Al alloy. The composition includes Cu of 12.5% by mass or more and 16.5% by mass or less, Al of 3.0% by mass or more and 5.5% by mass or less, and Fe or Co of 0.01% by mass or more and 2.0% by mass or less, with the balance being Au. The difference between the Al content and Cu content (Cu—Al) is 12% by mass or less. This superelastic alloy exhibits remarkable properties, including being Ni-free, excellent X-ray imaging capability, processability, and strength, making it suitable for medical applications.

Career Highlights

Throughout his career, Hideki Hosada has worked with prominent organizations. He has been associated with Tanaka Kikinzoku Kogyo Co., Ltd. and the Tokyo Institute of Technology. His work in these institutions has contributed significantly to advancements in material science.

Collaborations

Hideki Hosada has collaborated with notable colleagues, including Tomonari Inamura and Masaki Tahara. Their joint efforts have furthered research and development in the field of superelastic materials.

Conclusion

Hideki Hosada's innovative contributions to the development of superelastic alloys highlight his importance in the field of materials science. His work not only advances technology but also has practical applications in the medical industry.

Profile summary based on public USPTO records.
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