Shibukawa, Japan

Hideki Hayashi

This inventor holds 1 USPTO granted patent. Top assignee: Denka Company Limited. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Hayashi. Retrieved from https://idiyas.com/inventor/hideki-hayashi-aqdfcm08

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations by Hideki Hayashi

Introduction

Hideki Hayashi is a notable inventor based in Shibukawa, Japan. He has made significant contributions to the field of adhesive compositions, particularly in the development of a speaker that utilizes a unique adhesive formulation. His work is characterized by a focus on enhancing the curability and adhesive bonding ability of materials.

Latest Patents

Hayashi holds a patent for a "Speaker having an adhesive composition." This invention provides a composition that includes several components designed to improve adhesive properties. The components consist of polymerizable vinyl monomers and various additives that enhance the performance of the adhesive in speaker applications. He has 1 patent to his name.

Career Highlights

Hayashi is associated with Denka Company Limited, where he has been instrumental in advancing adhesive technologies. His innovative approach has led to the development of products that meet the demands of modern audio equipment.

Collaborations

Hayashi has worked alongside talented colleagues such as Yoshitsugu Goto and Chiaki Takano. Their collaborative efforts have contributed to the success of various projects within the company.

Conclusion

Hideki Hayashi's contributions to adhesive technology exemplify the spirit of innovation in the field of materials science. His work continues to influence the development of high-performance products in the audio industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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