Shimodate, Japan

Hideki Eriguchi

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Eriguchi. Retrieved from https://idiyas.com/inventor/hideki-eriguchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1991

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hideki Eriguchi

Introduction

Hideki Eriguchi is a notable inventor based in Shimodate, Japan. He has made significant contributions to the field of adhesive compositions, particularly for metal-clad laminates. His work has implications for various industries, including electronics and materials science.

Latest Patents

Eriguchi holds a patent for an adhesive composition specifically designed for metal-clad laminates. This innovative adhesive composition enhances the bonding strength and durability of metal-clad materials, making it a valuable asset in manufacturing processes.

Career Highlights

Hideki Eriguchi is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in developing advanced materials. His expertise in adhesive technologies has positioned him as a key figure in the company's research and development efforts.

Collaborations

Eriguchi has collaborated with notable colleagues, including Toshihisa Kumakura and Ken Nanaumi. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Hideki Eriguchi's contributions to adhesive compositions for metal-clad laminates highlight his role as an influential inventor in the materials science field. His work continues to impact various industries, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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