Hidekazu Takano

Title: Innovations of Hidekazu Takano

Introduction

Hidekazu Takano is a notable inventor based in Kouriyama, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced composite layers for circuit boards. With a total of 3 patents, his work has had a considerable impact on the industry.

Latest Patents

One of Takano's latest patents is a method of fabricating an internal composite layer for multilayer circuit boards. This innovative method involves treating a copper layer with a base or an accelerating agent to supply hydroxyl groups to its surface. Following this treatment, the copper layer is coated with a coupling agent, such as a silane coupling agent. This process enhances the adhesion strength between the copper layer and the coupling agent, resulting in excellent acid resistance without the formation of a copper oxide layer. Another significant patent involves an electric metal foil-plated laminate sheet, which is created by laminating a cured layer of a thermosetting resin composition with electroconductive foils. This composition includes a rubber-modified vinyl ester, showcasing Takano's expertise in combining materials for improved performance.

Career Highlights

Throughout his career, Hidekazu Takano has worked with prominent companies, including Matsushita Electric Works, Ltd. and Nippon Shokubai Kagaku Kogyo Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Takano has collaborated with esteemed colleagues such as Tetsuo Kunitomi and Shigehiro Okada. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Hidekazu Takano's contributions to the field of materials science and his innovative patents demonstrate his commitment to advancing technology. His work continues to influence the industry and inspire future innovations.