Company Filing History:
Years Active: 2012
Title: Innovations by Hidehiro Masuko
Introduction
Hidehiro Masuko is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of substrate storage technology. With a total of 3 patents to his name, Masuko's work reflects a commitment to innovation and practical solutions in his industry.
Latest Patents
Masuko's latest patents include a "Lid body for substrate storage container" and a "Wafer storage container." The substrate storage container features a locking mechanism that allows for secure opening and closing of the container body, which is designed to store a substrate of three sheets or less. This innovative locking mechanism is supported by a lid that is substantially laterally long when viewed from the front. The mechanism includes an advance/retreat engaging body that interacts with the inner periphery of the container body, ensuring a secure fit.
The wafer storage container is designed to store wafers and includes a container body with an opening, a window, and wafer support parts. It is equipped with delivery components such as a bottom plate, side handles, and a robotic flange. The lid of this container is designed to seal the opening securely and is made from self-extinguishing materials, ensuring safety and durability.
Career Highlights
Masuko is currently employed at Shin-Etsu Polymer Co., Ltd., where he continues to develop innovative solutions in substrate storage technology. His work has been instrumental in advancing the capabilities of storage containers used in various applications.
Collaborations
Throughout his career, Masuko has collaborated with talented individuals such as Satoshi Odashima and Toshiyuki Kamada. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Hidehiro Masuko's contributions to substrate storage technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the industry and pave the way for future innovations.