Kyoto, Japan

Hideharu Ohtsuki

This inventor holds 1 USPTO granted patent. Top assignee: Rengo Co., Ltd.. Active years: 1978.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1978

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1 patent (USPTO):Explore Patents

Title: Innovations of Hideharu Ohtsuki

Introduction

Hideharu Ohtsuki is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of materials science, particularly in the development of paper products. His innovative approach has led to advancements that enhance the performance of paper board.

Latest Patents

Ohtsuki holds a patent for a "Method for preparing paper board having improved wet compression strength." This invention focuses on a method that results in paper board with excellent wet tensile strength and compression strength. The process involves impregnating or coating the paper board with a specific mixture of an unsaturated vinyl ester prepolymer and selected monomers, followed by electron irradiation to cure the resinous mixture. He has 1 patent to his name.

Career Highlights

Ohtsuki is associated with Rengo Co., Ltd., a company known for its expertise in packaging and paper products. His work has contributed to the company's reputation for innovation in the industry.

Collaborations

He has collaborated with notable colleagues such as Toshio Okada and Hiroshi Inagaki, further enhancing the impact of his work in the field.

Conclusion

Hideharu Ohtsuki's contributions to the development of improved paper board technology demonstrate his commitment to innovation. His work continues to influence the materials science sector, showcasing the importance of research and development in creating advanced products.

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