Ichihara, Japan

Hideaki Shouji


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1991

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1 patent (USPTO):Explore Patents

Title: **Innovative Contributions of Hideaki Shouji in Carrier Tape Production**

Introduction

Hideaki Shouji, an inventive mind based in Ichihara, Japan, has made significant strides in the field of materials engineering. With one patent to his name, Shouji has provided valuable innovations that enhance the production process of carrier tapes, crucial components used in various electronic applications.

Latest Patents

Shouji's sole patent is titled "Process for producing a carrier tape." This innovative method concentrates on creating a carrier tape with a superior two-layer structure that is cost-effective, highly heat-resistant, and demonstrates remarkable flexibility. The process involves several detailed steps, including coating a polyimide varnish onto an electrically-conductive metal foil, baking it, and subsequently performing a series of punching, cutting, coating, exposing, developing, etching, and plating processes to yield an effective carrier tape.

Career Highlights

Shouji's work is prominently associated with Chisso Corporation, where he has contributed to advancements in material technology. His expertise in producing high-quality carrier tapes has positioned him as a notable inventor within his company and the broader industry.

Collaborations

Throughout his career, Hideaki Shouji has worked closely with colleagues Masamitsu Okamoto and Masami Wada. Their collective efforts have contributed to the innovative environment at Chisso Corporation, enhancing the potential for future breakthroughs in electronic manufacturing technologies.

Conclusion

Hideaki Shouji’s inventive process for producing carrier tapes showcases his dedication to quality and innovation in material development. As electronic devices continue to demand advanced components, Shouji's contributions underscore the importance of thoughtful engineering in meeting these challenges, thereby paving the way for future advancements in the field.

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