Hideaki Miwa

Title: Innovations of Hideaki Miwa in Dielectric Materials

Introduction

Hideaki Miwa is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of dielectric materials, particularly in the development of advanced components for printed wiring boards. His innovative work has led to the filing of a patent that addresses critical challenges in the manufacturing of double-sided copper clad laminates.

Latest Patents

Miwa holds a patent titled "Dielectric Filler Containing Resin for Use in Formation of Built-In Capacitor Layer of Printed Wiring Board and Double-Sided Copper Clad Laminate with Dielectric Layer Formed Using the Same Dielectric Filler Containing Resin, and Production Method of Double-Sided Copper Clad Laminate." This patent focuses on creating a dielectric layer that can be formed in various thicknesses without the need for a skeletal material, while also ensuring high strength. The invention utilizes a specific mixture of binder resins and nearly spherical dielectric powders to achieve its objectives.

Career Highlights

Miwa is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of materials science. His work has been instrumental in enhancing the performance and reliability of electronic components used in various applications.

Collaborations

Throughout his career, Miwa has collaborated with esteemed colleagues such as Toshifumi Matsushima and Akira Ichiryu. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Hideaki Miwa's contributions to dielectric materials and his innovative patent demonstrate his commitment to advancing technology in the electronics industry. His work not only addresses current challenges but also paves the way for future developments in printed wiring board technology.