Mitsui Minings & Melting Co., Ltd.

Hideaki Miwa

Tetsuro Sato

Toshifumi Matsushima

Fujio Kuwako

Kazuhiro Yamazaki

Akira Ichiryu

An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, 'a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 &#x3bc;m in the average particle size D, 0.2 to 2.0 &#x3bc;m in the weight cumulative particle size Dbased on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D/Dwhere the weight cumulative particle size Dand the average particle size Dobtained by the image analysis'; and the like are used.

DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE

Growing community of inventors

Ageo, Japan

Hideaki Miwa