Seoul, South Korea

Hi Gon Lee

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hi Gon Lee. Retrieved from https://idiyas.com/inventor/hi-gon-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:

goldMedal1 out of 834,570 
Other
 patents

Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Hi Gon Lee: Inventor of a Prefabricated Heat-Insulation Panel

Introduction

Hi Gon Lee is an inventor based in Seoul, South Korea. His patent work addresses heating-system design through a prefabricated heat-insulation panel that incorporates separate paths for hot-water circulation.

Latest Patents

Lee is associated with 1 patent: “Prefabricated Heat-Insulation Panel with Two Hot Water Flow Paths.” The panel contains two separate hot-water paths, with primary and secondary connection parts that connect to a boiler or enable circulation between adjacent panels. Its hot-water supply pipes are made of thermoplastic elastomer and have an inner polybutene layer containing rosin as an activator. The design aims to reduce the pipes’ diameter and length, decrease panel thickness, and minimize the load on the boiler.

Career Highlights

The patent reflects Lee’s focus on integrating hot-water circulation and insulation within a prefabricated panel. The proposed configuration combines separate flow paths and specialized pipe materials to support a more compact heating-panel design.

Collaborations

Lee’s listed coworker is Ha Rim Kim. No company is specified in the provided information.

Conclusion

Hi Gon Lee’s patented panel brings together insulation and dual hot-water flow paths, with design features intended to reduce panel dimensions and boiler load.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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