Houppeville, France

Hervé Cornu

This inventor holds 1 USPTO granted patent. Top assignees: Legrand, Legrand Snc. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hervé Cornu. Retrieved from https://idiyas.com/inventor/hervé-cornu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Hervé Cornu: Innovator in Tie Design

Introduction

Hervé Cornu is a notable inventor based in Houppeville, France. He has made significant contributions to the field of fashion accessories, particularly with his innovative tie design. His work exemplifies creativity and practicality in everyday items.

Latest Patents

Hervé Cornu holds a patent for a unique tie design. The patent describes a tie that includes a strap with two end segments connected by an extensible intermediate portion. This portion is equipped with a series of frangible bridges, each linking a first part of the intermediate section to a second part. Notably, two or more of these frangible bridges feature different sections, enhancing the tie's functionality and style. He has 1 patent to his name.

Career Highlights

Throughout his career, Hervé Cornu has worked with prominent companies, including Legrand SNC and Legrand. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects.

Collaborations

Hervé has collaborated with Jean-Pierre Barriuso, further enriching his professional journey and expanding his creative horizons.

Conclusion

Hervé Cornu's inventive spirit and dedication to design have led to the creation of a unique tie that combines style and functionality. His contributions to the fashion accessory industry are commendable and reflect his innovative mindset.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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