Company Filing History:
1 out of 8,396 
1 out of 2 
1 out of 10 Years Active: 2000-2001
Title: Hermann Holzer: Innovator in Thermal Management Technologies
Introduction
Hermann Holzer is a notable inventor based in Vienna, Austria. He has made significant contributions to the field of thermal management technologies, particularly in the development of advanced materials for electronic devices. With a total of two patents to his name, Holzer's work focuses on enhancing the efficiency and performance of electronic components.
Latest Patents
Holzer's latest patents include innovative designs that address critical challenges in the electronics industry. One of his patents is for a heat sink designed for electric and/or electronic devices. This heat sink is specifically adapted for use with semiconductor chips, such as integrated circuits, and is formed from a material that includes whiskers. Another significant patent involves a minimal thermal expansion, high thermal conductivity metal-ceramic composite. This invention provides techniques for forming composites that include XW₂O₈, where X can be Zr, Hf, or a combination of both, dispersed within a continuous metal matrix. The resulting material exhibits a low to zero coefficient of thermal expansion while maintaining high thermal and electrical conductivity.
Career Highlights
Throughout his career, Hermann Holzer has worked with prestigious institutions, including the Massachusetts Institute of Technology and Electrovac GmbH. His experience in these organizations has allowed him to refine his expertise in materials science and thermal management.
Collaborations
Holzer has collaborated with esteemed colleagues, including David C. Dunand and Ernst Hammel. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.
Conclusion
Hermann Holzer's innovative work in thermal management technologies has made a significant impact on the electronics industry. His patents reflect a commitment to improving the performance and reliability of electronic devices through advanced materials.