Massachusetts Institute of Technology

Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.b.h.

Electrovac Gesmbh

Hermann Holzer

David C Dunand

Ernst Hammel

A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.

Heat sink for electric and/or electronic devices

The invention provides techniques for forming composites including XW.sub.2 O.sub.8, where X=Zr, Hf, or a combination, dispersed within a continuous, metal matrix. A low to zero coefficient of thermal expansion material, with high thermal and electrical conductivity, results. One method for forming the composite involves coating particles of XW.sub.2 O.sub.8 with a layer of metal, then isostatically pressing the particles under conditions amenable to formation of a composite. The technique of coating, with a more malleable phase, a phase that undergoes a disadvantageous phase transformation of decomposition upon exposure to a threshold pressure at a set temperature can be applied to a variety of materials.

Growing community of inventors

Vienna, Austria

Hermann Holzer