Herbert E LeCornu

Title: Herbert E. LeCornu: Innovator in Heat Sink Technology

Introduction

Herbert E. LeCornu is a notable inventor based in Newark, California. He has made significant contributions to the field of thermal management in electronics, particularly through his innovative designs for heat sinks. With a total of 2 patents, LeCornu's work has been instrumental in enhancing the performance and reliability of electronic components.

Latest Patents

LeCornu's latest patents include a unique heat sink attachment designed to prevent the detachment of heat sinks from printed circuit boards (PCBs). This invention features a body that is attached to the board and extends above the tops of the heat sinks. The design incorporates a curved tongue that acts as a spring, ensuring that the heat sink remains securely in place. Additionally, he has developed a compact heat sink and fan system for cooling CPU chips. This system is specifically designed to operate efficiently in limited spaces, maintaining optimal temperatures for high-performance chips.

Career Highlights

Herbert E. LeCornu has worked at Sun Microsystems, Inc., where he has applied his expertise in thermal management to various projects. His innovative designs have contributed to the advancement of cooling technologies in the computing industry.

Collaborations

LeCornu has collaborated with notable colleagues such as Nagaraj P. Mitty and Deviprasad Malladi, further enhancing the impact of his work in the field.

Conclusion

Herbert E. LeCornu's contributions to heat sink technology demonstrate his commitment to innovation in electronics. His patents reflect a deep understanding of thermal management, which is crucial for the performance of modern electronic devices.