Solon, OH, United States of America

Henry Windischmann


Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 46(Granted Patents)


Company Filing History:


Years Active: 1987-1993

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3 patents (USPTO):Explore Patents

Title: The Innovations of Henry Windischmann

Introduction

Henry Windischmann is a notable inventor based in Solon, OH (US). He has made significant contributions to the field of materials science, particularly in the development of advanced thin films. With a total of 3 patents to his name, Windischmann's work has had a lasting impact on various industries.

Latest Patents

Windischmann's latest patents include a process for forming transparent silicon carbide films and a novel dual ion beam deposition technique. The first patent describes a method for creating a transparent silicon carbide film on substrates through magnetron sputtering in a partial vacuum with hydrogen and argon. The second patent outlines a dual ion beam sputtering process for depositing high-density thin films. This innovative technique utilizes two ion beams, one containing heavy sputtering ions like argon, and the other with ions of specific energy levels. The resulting films exhibit densities comparable to bulk samples and enhanced photoconductivity in hydrogenated amorphous silicon films.

Career Highlights

Throughout his career, Windischmann has worked with prominent companies such as the Standard Oil Company and the Carborundum Company. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in material technologies.

Collaborations

Windischmann has collaborated with notable colleagues, including David A Glocker and John R Miller. These partnerships have fostered an environment of innovation and creativity, leading to the development of new technologies and processes.

Conclusion

Henry Windischmann's contributions to the field of materials science through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in thin film technologies and materials engineering.

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