Henry Descalzo Bathan

Title: The Innovations of Henry Descalzo Bathan

Introduction

Henry Descalzo Bathan is a notable inventor based in Thousand Oaks, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative packaging solutions for electronic components.

Latest Patents

One of his latest patents is for a Side-solderable leadless package. This invention involves forming a leadframe by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe, and a solder wettable layer is plated over this surface. An encapsulant is then deposited over the leadframe after the plating process. Another significant patent is for a semiconductor device and method of forming a substrate with a 3-sided wettable flank. This device features a substrate with leads formed on two or more sides, allowing for enhanced electrical connections and encapsulation of components.

Career Highlights

Henry Bathan is currently employed at Semtech Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced packaging techniques that improve the performance and reliability of electronic devices.

Collaborations

Throughout his career, Henry has collaborated with talented individuals such as Yingyu Chen and Zigmund Ramirez Camacho. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Henry Descalzo Bathan's contributions to semiconductor technology through his innovative patents highlight his expertise and dedication to advancing the field. His work at Semtech Corporation and collaborations with other professionals further emphasize his impact on the industry.