The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Sep. 28, 2023
Applicant:
Semtech Corporation, Camarillo, CA (US);
Inventor:
Henry Descalzo Bathan, Thousand Oaks, CA (US);
Assignee:
Semtech Corporation, Camarillo, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2005.12); H01L 21/48 (2005.12); H01L 21/56 (2005.12); H01L 21/78 (2005.12);
U.S. Cl.
CPC ...
H01L 23/49565 (2012.12); H01L 21/4825 (2012.12); H01L 21/4828 (2012.12); H01L 21/565 (2012.12); H01L 21/78 (2012.12); H01L 23/49503 (2012.12); H01L 23/49513 (2012.12); H01L 23/49548 (2012.12); H01L 23/49562 (2012.12); H01L 2224/16245 (2012.12); H01L 2224/97 (2012.12); H01L 2924/181 (2012.12);
Abstract
A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.