Neerpelt, Belgium

Henricus Ac Deeben

This inventor holds 1 USPTO granted patent. Top assignee: Koninklijke Philips Corporation N.v.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henricus Ac Deeben. Retrieved from https://idiyas.com/inventor/henricus-ac-deeben

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 2003

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Henricus Ac Deeben

Introduction

Henricus Ac Deeben is a notable inventor based in Neerpelt, Belgium. He has made significant contributions to the field of printed circuit technology. His innovative approach has led to the development of a unique patent that enhances the functionality of mobile devices.

Latest Patents

Henricus Ac Deeben holds a patent for a synthetic resin capping layer on a printed circuit. This invention provides a printed circuit with a capping layer that exhibits a continuous variation of mechanical properties in a direction at right angles to its surface. The application of this technology is particularly relevant in mobile telephones and other portable devices, where the capping layer can also serve as the housing of the device. He has 1 patent to his name.

Career Highlights

Deeben is associated with Koninklijke Philips Corporation N.V., a leading company in the electronics industry. His work at Philips has allowed him to explore and implement innovative solutions in electronic design and manufacturing.

Collaborations

Throughout his career, Henricus Ac Deeben has collaborated with notable colleagues, including Reinhold Wimberger Friedl and Egbert Broeksema. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Henricus Ac Deeben's contributions to the field of printed circuit technology exemplify the spirit of innovation. His patent for a synthetic resin capping layer showcases his ability to enhance the functionality of modern devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…