Neuilly sur Seine, France

Henri-Georges Bois

This inventor holds 1 USPTO granted patent. Top assignee: Flexico-France. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henri-Georges Bois. Retrieved from https://idiyas.com/inventor/henri-georges-bois-ds72xeev

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Innovations by Henri-Georges Bois in Packaging Technology

Introduction

Henri-Georges Bois is a notable inventor based in Neuilly sur Seine, France. He has made significant contributions to the field of packaging technology, particularly through his innovative designs and methods.

Latest Patents

Henri-Georges Bois holds a patent for a device and method for making packaging bags. This apparatus is designed for forming reclosable bags from a continuous film fitted with at least one closure tape. The invention includes a set of heat-sealed jaws that are positioned transversely relative to the film's travel direction. Additionally, it features a sensor that detects the presence of the tape in a predetermined position. The apparatus also incorporates means to correctly reposition the film in relation to the heat-sealed jaws, thereby eliminating drift caused by the film's elasticity.

Career Highlights

Henri-Georges Bois is associated with Flexico France, where he applies his expertise in packaging solutions. His work has contributed to advancements in the efficiency and functionality of packaging processes.

Conclusion

Henri-Georges Bois is a prominent figure in the packaging industry, recognized for his innovative patent that enhances the production of reclosable bags. His contributions continue to influence packaging technology today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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