Dongguan, China

Henning Hansen

This inventor holds 6 USPTO granted patents and 5 published patent applications. Top assignee: Dongguan Luxshare Technologies Co., Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henning Hansen. Retrieved from https://idiyas.com/inventor/henning-hansen-wfcwdi4a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 66.7

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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6 patents (USPTO):Explore Patents

Title: Henning Hansen: Innovator in Connector Technology

Introduction

Henning Hansen is a notable inventor based in Dongguan, China. He has made significant contributions to the field of connector technology, particularly through his innovative designs that enhance connectivity solutions.

Latest Patents

Henning Hansen holds a patent for a "Connector module with high-density cable connectors." This invention features a connector module that includes a bracket and multiple cable connectors. The bracket is designed with four side walls, each defining several receiving grooves. The cable connectors consist of a body, conductive terminals, and a cable, with the body being partially received in the grooves. The conductive terminals are engineered to press against the conductive elements of a circuit board, ensuring reliable connections.

Career Highlights

Henning Hansen is associated with Dongguan Luxshare Technologies Co., Ltd., a company known for its advancements in connectivity solutions. His work at Luxshare has positioned him as a key player in the development of high-density connector modules.

Collaborations

Henning collaborates with talented coworkers such as Kunlin Yao and RongZhe Guo, contributing to innovative projects within the company.

Conclusion

Henning Hansen's contributions to connector technology exemplify his commitment to innovation and excellence in the field. His patent for a high-density connector module showcases his ability to address modern connectivity challenges effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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