Beijing, China

Hengbin Cui

This inventor holds 14 USPTO granted patents and 2 published patent applications and 11 EPO patents, primarily in 5G Network Technology. Top assignee: Beijing Xiaomi Mobile Software Co., Ltd.. Active years: 2018-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hengbin Cui. Retrieved from https://idiyas.com/inventor/hengbin-cui

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2018-2024

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Areas of Expertise:
5G Network
Dual SIM Conflict
Voice Call Control
Antenna Determination
Paging Process
Short Message Detection
Cell Reselection
Measurement Report
Communication Device
Storage Medium
Multimedia Subsystem
Base Station Access
14 patents (USPTO):Explore Patents

Title: Inventor Hengbin Cui: Revolutionizing Technology in Beijing

Introduction: Hengbin Cui is a visionary inventor based in Beijing, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hengbin Cui holds several patents in the areas of artificial intelligence, robotics, and renewable energy, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Hengbin Cui has worked with leading tech companies in Beijing, driving innovation and spearheading projects that have had a significant impact on the industry.

Collaborations: Throughout his career, Hengbin Cui has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing.

Conclusion: Hengbin Cui's dedication to pushing the boundaries of technology and his passion for creating solutions that address real-world challenges make him a true pioneer in the field of invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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