Heng Yang

Title: Innovations of Heng Yang in Stress Sensor Technology

Introduction

Heng Yang is a notable inventor based in Wuxi, China. He has made significant contributions to the field of sensor technology, particularly in the development of stress sensors. His innovative work has led to the creation of a unique stress sensor structure that has practical applications in various industries.

Latest Patents

Heng Yang holds a patent for a "Stress sensor structure and a manufacturing method thereof." This invention discloses a stress sensor structure that includes a substrate with a blind-hole on its first surface. The structure features a first and second piezoresistive layer, which are formed from materials exhibiting piezoresistive effects. These layers are interconnected at their bottom portions and are separated by a second insulating layer. The design also incorporates first and second electrodes connected to the respective piezoresistive layers. The resistance measured by applying an external voltage between these electrodes can indicate the stress of the TSV structure, particularly its axial stress. This innovation allows for precise measurement of stress in various applications.

Career Highlights

Heng Yang is associated with the National Center for Advanced Package, where he continues to advance his research and development efforts. His work in this institution has positioned him as a key figure in the field of advanced packaging technologies.

Collaborations

Heng Yang has collaborated with notable colleagues such as Wen Yin and Chuanguo Dou. Their combined expertise has contributed to the success of various projects and innovations in sensor technology.

Conclusion

Heng Yang's contributions to stress sensor technology exemplify the importance of innovation in engineering and materials science. His patent and ongoing work at the National Center for Advanced Package highlight his role as a leading inventor in this field.