Company Filing History:
Years Active: 2017
Title: The Innovations of Heng-Sheng Wang
Introduction
Heng-Sheng Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that enhances the efficiency and reliability of electronic devices.
Latest Patents
Heng-Sheng Wang holds a patent for a semiconductor package and method of manufacturing thereof. This patent describes a semiconductor package that comprises a semiconductor chip with an active surface featuring a conductive pad. An electroplated Au–Sn alloy bump is positioned over the active surface, and a substrate with conductive traces is included to electrically couple with the bump. The composition of the electroplated Au–Sn alloy bump is uniformly distributed, enhancing the performance of the semiconductor package.
Career Highlights
Heng-Sheng Wang is currently employed at Chipmos Technologies Inc., where he continues to innovate in semiconductor packaging technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable for various applications.
Collaborations
Heng-Sheng has collaborated with notable colleagues such as Tung Bao Lu and Tzu-Han Hsu. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.
Conclusion
Heng-Sheng Wang's contributions to semiconductor technology through his patent and work at Chipmos Technologies Inc. highlight his role as a key innovator in the field. His advancements continue to influence the future of electronic devices.