Taoyuan, Taiwan

Heng-Sheng Peng

This inventor holds 1 USPTO granted patent. Top assignee: Tdk Taiwan Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heng-Sheng Peng. Retrieved from https://idiyas.com/inventor/heng-sheng-peng-w6dcqerc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 23.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Heng-Sheng Peng: Innovator in Coil Module Technology

Introduction

Heng-Sheng Peng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of coil module technology. His innovative approach has led to the development of a unique patent that enhances the functionality of coil mechanisms.

Latest Patents

Heng-Sheng Peng holds a patent for a coil module, which includes a second coil mechanism. This second coil mechanism features a third coil assembly and a second base that corresponds to the third coil assembly. The second base is equipped with a positioning assembly that corresponds to a first coil mechanism. This invention showcases his expertise in creating efficient and effective coil systems.

Career Highlights

Heng-Sheng Peng is currently employed at TDK Taiwan Corporation, where he continues to work on advancing coil technology. His role at TDK allows him to collaborate with other talented professionals in the field.

Collaborations

Some of his coworkers include Feng-Lung Chien and Tsang-Feng Wu. Their collective efforts contribute to the innovative environment at TDK Taiwan Corporation.

Conclusion

Heng-Sheng Peng is a distinguished inventor whose work in coil module technology has made a significant impact. His patent reflects his commitment to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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