Heng-I Lee

Title: Heng-I Lee: Innovator in LED Packaging Technology

Introduction

Heng-I Lee is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of LED packaging technology, holding a total of 3 patents. His innovative approaches have advanced the manufacturing processes of LED package structures.

Latest Patents

Heng-I Lee's latest patents include a manufacturing method of an LED package structure. This method involves several steps, starting with the provision of an LED package structure assembly that consists of a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set. The process includes using a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer, forming a plurality of sawing grooves on the substrate layer. Subsequently, a second blade is employed to saw the assembly along each sawing groove until it passes through the substrate layer, resulting in multiple LED package structures that are separated from each other. Notably, the hardness of the first blade is greater than that of the second blade, and the thickness of the second blade is less than that of the first blade.

Career Highlights

Heng-I Lee has worked with prominent companies in the industry, including Lite-On Opto Technology (Changzhou) Co., Ltd. and Lite-On Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in LED technology.

Collaborations

Some of Heng-I Lee's notable coworkers include Kuo-Ming Chiu and Han-Hsing Peng. Their collaborative efforts have further enhanced the innovation landscape in which they operate.

Conclusion

Heng-I Lee's contributions to LED packaging technology through his patents and career experiences highlight his role as a key innovator in the field. His work continues to influence advancements in LED manufacturing processes.