Lite-on Technology Corporation

Lite-on Opto Technology (changzhou) Co., Ltd.

Heng-I Lee

Kuo-Ming Chiu

Han-Hsing Peng

Meng-Sung Chou

Yu-Yu Chang

Shih-Chiang Yen

A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Manufacturing method of LED package structure

LED package structure and manufacturing method thereof

A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R), wherein R/R=M&#x221a;{square root over (2)} and M=0.8&#x2dc;1.2.

LED package structure and lens thereof

Growing community of inventors

Taichung, Taiwan

Heng-I Lee