This inventor holds 2 USPTO granted patents. Top assignee: Apple Inc.. Active years: 2015-2016.
Location History:
- Cupertino, CA (US) (2015)
- Kaohsiung, TW (2016)
Company Filing History:
Years Active: 2015-2016
Title: Heng-Hsi Wu: Innovator in Optically Clear Adhesives and Flexible Circuits
Introduction
Heng-Hsi Wu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the fields of optically clear adhesives and flexible circuit technology. With a total of 2 patents, his work has garnered attention in the industry.
Latest Patents
Wu's latest patents include a liquid optically clear adhesive lamination process control. This patent describes methods and devices for using liquid optically clear adhesives (LOCAs). It outlines a method for detecting uncured LOCA between a first substrate and a second substrate. Additionally, it presents an improved method for curing a laminated stack up that has LOCA between the two substrates. This method includes a pre-curing technique that involves variable exposure of the LOCA. Furthermore, it describes an improved light-emitting diode (LED) unit assembly designed for exposing a laminated stack up to ultraviolet (UV) light during the pre-curing process. A method for testing the LED unit assembly prior to the pre-curing process is also included.
Another significant patent is the T-flex bonder. This invention allows a flexible circuit with multiple independent mounting points to be mounted to substrates by positioning the mounting points independently and concurrently in x, y, and theta (angular rotation) using vacuum chucks. In one embodiment, the vacuum chucks can be guided by computer-aided vision to locate and match fiducials on the flex circuit with those on the substrate. Hot bars can be utilized in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.
Career Highlights
Heng-Hsi Wu is currently employed at Apple Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of adhesive applications and flexible circuit designs.
Collaborations
Wu has collaborated with notable colleagues such as Silvio Grespan and Kuo-Hua Sung. Their combined expertise has contributed to the success of various projects and innovations.
Conclusion
Heng-Hsi Wu is a prominent inventor whose work in optically clear adhesives and flexible circuits has made a significant impact in the technology sector. His patents reflect a commitment to innovation and excellence in engineering.