Company Filing History:
Years Active: 2001-2006
Title: Innovations of Henan Hao
Introduction
Henan Hao is a notable inventor based in Fremont, CA, who has made significant contributions to the field of electro-chemical deposition systems. With a total of 2 patents, his work focuses on enhancing the efficiency and effectiveness of processing systems in the semiconductor industry.
Latest Patents
Henan Hao's latest patents include "Plating uniformity control by contact ring shaping" and "Electro-chemical deposition system." The first patent describes an apparatus designed to provide an electrical bias to a substrate in a processing system. This apparatus features a conductive annular body with a central opening, a substrate seating surface, and a plurality of scallops formed on the opposing surface. The electrical contacts on the substrate seating surface engage the plating surface of the substrate, ensuring uniform plating. The second patent presents an electro-chemical deposition system characterized by a flexible architecture that can be expanded to meet future designs and gap fill requirements. This system includes a mainframe with a wafer transfer robot, a loading station, processing cells, and an electrolyte supply, along with various stations for edge bead removal and thermal annealing.
Career Highlights
Henan Hao is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work at Applied Materials has allowed him to develop innovative solutions that address the challenges faced in electro-chemical deposition processes.
Collaborations
Henan has collaborated with notable coworkers such as Yezdi N Dordi and Muhammad Atif Malik, contributing to advancements in their respective fields.
Conclusion
Henan Hao's contributions to the field of electro-chemical deposition systems demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in semiconductor processing, making him a valuable asset to Applied Materials, Inc.