Hong Kong, China

Hemin Feng

This inventor holds 1 USPTO granted patent. Top assignee: City University of Hong Kong. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hemin Feng. Retrieved from https://idiyas.com/inventor/hemin-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Hemin Feng: Patent Innovation in Mental Health and Nerve-Related Pain

Introduction

Hemin Feng is an inventor associated with City University of Hong Kong. His patent work addresses potential treatments for mental disorders and pain associated with nerve injury.

Latest Patents

The supplied information identifies one patent for Feng: Method and Composition for Treating Mental Disorder and Pain Associated with Nerve Damage. The patent describes methods that use a cholecystokinin-2 receptor antagonist, or a pharmaceutically acceptable salt of the antagonist, to treat mental disorders or pain associated with nerve injury. It also describes a pharmaceutical composition containing the antagonist as an active ingredient, one or more antidepressant compounds, and a pharmaceutically acceptable excipient. Feng is credited with 1 patent in the information provided.

Career Highlights

Feng’s listed patent reflects research into pharmaceutical approaches to mental health and nerve-related pain. His affiliation with City University of Hong Kong connects this work to an academic research institution.

Collaborations

Sarah Hau and Xu Zhang are identified as Feng’s coworkers. The supplied information does not specify their roles or contributions to the patent.

Conclusion

Hemin Feng’s listed invention explores the use of a cholecystokinin-2 receptor antagonist in treatments for mental disorders and pain associated with nerve injury.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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