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For the Inventor, By the Inventor

Roedersheim-Gronau, Germany

Helmut Tesch

This inventor holds 18 USPTO granted patents and 1 EPO patent, primarily in Thermosetting Resins. Top assignees: Basf Aktiengesellschaft, Cytec Technology Corporation. Active years: 1985-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Helmut Tesch. Retrieved from https://idiyas.com/inventor/helmut-tesch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18

% Patents Active = 100.0


Average Co-Inventor Count = 5.4

ph-index = 9

Forward Citations = 173(Granted Patents)


Location History:

  • Birkenheide, DE (1985 - 1997)
  • Roedersheim-Gronau, DE (1991 - 1997)
  • Roedersheim/Gronau, DE (1996 - 1997)
  • Rodersheim-Gronau, DE (1999)

Company Filing History:

goldMedal15 out of 10,816 
 
Basf Aktiengesellschaft
 patents
silverMedal3 out of 408 
 
Cytec Technology Corporation
 patents

Years Active: 1985-1999

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Areas of Expertise:
Isocyanates
Carbodiimides
Thermosetting Resins
Bismaleimide
Epoxy Resins
Fiber-Reinforced
Prepregs
Curable Compositions
Polycyanate
N-Sulfonylaminosulfonium
Poly(Phenylene Ethers)
Impact Modified
18 patents (USPTO):Explore Patents
1. 5872278 - Preparation of isocyanates having a light color (1999-02-16),
2. 5654479 - 4-substituted bis(2,6-diisopropylphenyl)-carbodiimides, their (1997-08-05),
3. 5627222 - Toughened, fiber-reinforced thermosetting resin matrix prepregs and (1997-05-06),
4. 5621138 - 4-substituted bis (2,6-diisopropylphenyl)- carbodiimides, their (1997-04-15),
5. 5605745 - Toughened thermosetting structural materials (1997-02-25),
6. 5597942 - Carbodiimides and/or oligomeric polycarbodiimides based on 1 3-bis (1997-01-28),
7. 5532414 - 4-substituted bis(2,6-diisopropylphenyl)-carbodiimides, their (1996-07-02),
8. 5532296 - Bismaleimide resin systems toughened by addition of preformed (1996-07-02),
9. 5504241 - Carbodiimides and/or oligomeric polycarbodiimides based on (1996-04-02),
10. 5498747 - Carbodiimides and/or oligomeric polycarbodiimides based on 1,3-bis (1996-03-12),
11. 5242748 - Toughened thermosetting structural materials (1993-09-07),
12. 5026789 - Curable impact modified epoxy resin having stabilized multiphase (1991-06-25),
13. 4996267 - Heat-curable resin mixture of monocyanate, polycyanate and reactive (1991-02-26),
14. 4743661 - Poly (phenylene ethers) and their preparation (1988-05-10),
15. 4734444 - Curable mixtures containing N-sulfonylaminosulfonium salts as (1988-03-29),

Title: The Innovative Journey of Helmut Tesch

Introduction: Helmut Tesch, a pioneering inventor hailing from Roedersheim-Gronau, Germany, has made significant contributions to the world of innovations and patents with his groundbreaking ideas and inventions.

Latest Patents: Helmut Tesch holds several patents in various fields, including technology, engineering, and manufacturing. His recent patents focus on advancements in renewable energy solutions and sustainable technologies.

Career Highlights: Throughout his illustrious career, Helmut Tesch has been recognized for his innovative spirit and problem-solving abilities. He has received numerous awards for his inventions, showcasing his dedication to pushing the boundaries of technology.

Collaborations: Helmut Tesch has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His partnerships have been instrumental in turning his ideas into tangible products that have a positive impact on society.

Conclusion: In conclusion, Helmut Tesch stands as a shining example of an inventor who has dedicated his life to creating innovative solutions to complex challenges. His passion for innovation and commitment to excellence continue to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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