Wangs, Switzerland

Helmut Daxinger


Average Co-Inventor Count = 2.0

ph-index = 10

Forward Citations = 225(Granted Patents)


Company Filing History:


Years Active: 1977-2000

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11 patents (USPTO):Explore Patents

Title: Helmut Daxinger: Innovator in Sputtering Technology

Introduction

Helmut Daxinger is a notable inventor based in Wangs, Switzerland. He has made significant contributions to the field of sputtering technology, holding a total of 11 patents. His innovative designs and processes have advanced the capabilities of sputtering apparatuses, making them more efficient and effective.

Latest Patents

Daxinger's latest patents include a target arrangement with a circular plate and a magnetron designed for sputtering applications. The target arrangement features a circular plate target with either a circumferential protrusion or recess, which is symmetrical about a central plane. This design allows for easy switching between the top and bottom surfaces of the target, enhancing the sputtering process. Additionally, he has developed a vacuum treatment chamber that includes a sputtering electrode and a counter electrode, which together define a plasma discharge area. This innovative chamber design facilitates a more efficient plasma discharge, improving the overall sputtering process.

Career Highlights

Throughout his career, Helmut Daxinger has worked with prominent companies in the industry, including Balzers Aktiengesellschaft and Balzers Patent-und Beteiligungs-aktiengesellschaft. His experience in these organizations has contributed to his expertise in sputtering technology and patent development.

Collaborations

Daxinger has collaborated with several professionals in his field, including Erich Bergmann and Rainer Buhl. These collaborations have likely enriched his work and led to further advancements in sputtering technology.

Conclusion

Helmut Daxinger's contributions to sputtering technology through his patents and collaborations have made a significant impact in the field. His innovative designs continue to influence the development of advanced sputtering apparatuses.

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