Company Filing History:
Years Active: 2013-2015
Title: Innovations by Helen Hongwei Li
Introduction
Helen Hongwei Li is a prominent inventor based in San Jose, CA. She has made significant contributions to the field of semiconductor devices, holding 2 patents that showcase her innovative approach to technology.
Latest Patents
One of her latest patents is focused on devices that include a bond pad having a protective sidewall seal. This device features a sensor package that includes a light sensor, filters, and bond pads. The light sensor is formed on a semiconductor device that provides sensor information related to light. The perimeter of each bond pad is covered by a protective layer, forming a sidewall seal. This sensor package can be utilized in various applications, including ambient light sensors, cameras, and handheld electronic devices.
Another notable patent by Helen is a method for opening a bond pad on a semiconductor device. This method involves removing a first layer to expose a portion of the bond pad and forming a protective layer over the exposed area. Subsequent processing of the semiconductor device is performed, followed by the removal of the protective layer to expose another portion of the bond pad.
Career Highlights
Helen currently works at Intersil Americas Inc., where she continues to develop innovative solutions in semiconductor technology. Her work has significantly impacted the industry, particularly in enhancing the functionality and reliability of electronic devices.
Collaborations
Helen collaborates with talented individuals such as Joy Ellen Jones and Phillip J Benzel, contributing to a dynamic and innovative work environment.
Conclusion
Helen Hongwei Li's contributions to semiconductor technology through her patents and collaborations highlight her role as a leading inventor in her field. Her innovative solutions continue to shape the future of electronic devices.