The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Nov. 30, 2010
Helen Hongwei LI, San Jose, CA (US);
Joy Ellen Jones, Fremont, CA (US);
Phillip J. Benzel, Pleasonton, CA (US);
Jeanne M. Mcnamara, St. Cloud, FL (US);
John T. Gasner, Satellite Beach, FL (US);
Helen Hongwei Li, San Jose, CA (US);
Joy Ellen Jones, Fremont, CA (US);
Phillip J. Benzel, Pleasonton, CA (US);
Jeanne M. McNamara, St. Cloud, FL (US);
John T. Gasner, Satellite Beach, FL (US);
Intersil Americas Inc., Milpitas, CA (US);
Abstract
A method for opening a bond pad on a semiconductor device is provided. The method comprises removing a first layer to expose a first portion of the bond pad and forming a protective layer over the exposed first portion of the bond pad. The method further comprises performing subsequent processing of the semiconductor device and removing the protective layer to expose a second portion of the bond pad.