Zurich, Switzerland

Heinz Stunzi


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2005

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Heinz Stunzi - Innovator in Chemical Mechanical Polishing Technology

Introduction

Heinz Stunzi is a notable inventor based in Zurich, Switzerland. He has made significant contributions to the field of chemical mechanical polishing (CMP) technology. His work focuses on enhancing the efficiency and effectiveness of CMP processes, particularly in the semiconductor industry.

Latest Patents

Heinz Stunzi holds a patent for an "Apparatus for detecting CMP endpoint in acidic slurries." This innovative apparatus is designed to measure ammonia gas concentration during an ongoing CMP cycle that utilizes an acidic CMP slurry. This invention plays a crucial role in ensuring optimal performance and precision in CMP operations.

Career Highlights

Throughout his career, Heinz has worked with prominent companies, including IBM and Ecophysics AG. His experience in these organizations has allowed him to develop and refine his expertise in CMP technology, contributing to advancements in the field.

Collaborations

Heinz has collaborated with notable professionals in his field, including Leping Li and Steven G. Barbee. These collaborations have further enriched his work and have led to innovative solutions in CMP technology.

Conclusion

Heinz Stunzi's contributions to the field of chemical mechanical polishing are significant and impactful. His patent and career achievements reflect his dedication to innovation and excellence in technology.

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