La Trinidad, Philippines

Heintje Sardonas Vilaga

This inventor holds 2 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 2009-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heintje Sardonas Vilaga. Retrieved from https://idiyas.com/inventor/heintje-sardonas-vilaga

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2009-2011

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2 patents (USPTO):Explore Patents

Title: Heintje Sardonas Vilaga and Semiconductor Wafer Sawing Innovations.

Introduction

Heintje Sardonas Vilaga is an inventor associated with La Trinidad, Philippines. His patent work focuses on semiconductor wafer sawing systems and methods, including techniques designed to help remove contaminants during the sawing process. He is associated with Texas Instruments Corporation and holds 2 patents.

Latest Patents

Vilaga’s listed patents are “Semiconductor wafer sawing system and method” and “Method for sawing semiconductor wafer.” Both describe securing a wafer in a sawing position so that at least part of the exposed surface lies below the wafer’s center of gravity. This arrangement uses gravity to assist in removing contaminants from the wafer during sawing.

Career Highlights

Vilaga’s patent portfolio reflects an emphasis on semiconductor manufacturing processes. The described approach incorporates wafer positioning into the sawing operation to support contaminant removal.

Collaborations

Vilaga’s listed coworkers include Ella Chan Sarmiento and Patricio Vergara Ancheta, Jr. The available information identifies these professional associations but does not specify their roles in the patents.

Conclusion

Heintje Sardonas Vilaga’s two listed patents address semiconductor wafer sawing, with a shared focus on using wafer positioning and gravity to assist contaminant removal.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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