Company Filing History:
Years Active: 2014-2017
Title: Heiko Knoll: Innovator in Metal-Ceramic Bonding Technologies
Introduction
Heiko Knoll is a notable inventor based in Marburg, Germany. He has made significant contributions to the field of materials science, particularly in the area of metal-ceramic bonding technologies. With a total of 2 patents, his work has implications for various electronic applications.
Latest Patents
Heiko Knoll's latest patents include a method of joining metal-ceramic substrates to metal bodies. This innovative method involves using a metal alloy to create a strong bond between a metal-ceramic substrate and a metal body, which is particularly useful in electronic appliances. The metal body, with a thickness of less than 1.0 mm, utilizes an aluminum-containing alloy with a liquidus temperature exceeding 450°C. This results in a robust metal-ceramic module that can function effectively as a circuit carrier, with the metal body serving as a cooling component.
Another significant patent by Knoll is a method for the manufacture of double-sided metallized ceramic substrates. This invention streamlines the bonding process, allowing a ceramic substrate to be bonded to both sides of a metal plate or foil in a single sequence. The specially designed carrier used in this process ensures that the composite can be detached without any residue after bonding.
Career Highlights
Heiko Knoll is currently associated with Ixys Semiconductor GmbH, where he continues to develop innovative solutions in semiconductor technology. His expertise in metal-ceramic bonding has positioned him as a key player in advancing electronic component manufacturing.
Collaborations
Heiko has collaborated with notable colleagues such as Werner Weidenauer and Thomas Spann, contributing to the advancement of their shared projects and innovations.
Conclusion
Heiko Knoll's contributions to metal-ceramic bonding technologies reflect his commitment to innovation in the field of materials science. His patents not only enhance the functionality of electronic appliances but also pave the way for future advancements in semiconductor technology.