The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Jun. 10, 2011
Applicants:
Werner Weidenauer, Lampertheim, DE;
Thomas Spann, Fürth, DE;
Heiko Knoll, Marburg, DE;
Inventors:
Assignee:
IXYS Semiconductor GmbH, Lampertheim, DE;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 37/02 (2006.01); H05K 3/38 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C04B 37/021 (2013.01); C04B 2237/341 (2013.01); C04B 2237/704 (2013.01); C04B 2235/9623 (2013.01); C04B 2237/54 (2013.01); C04B 2237/561 (2013.01); H05K 3/385 (2013.01); C04B 37/025 (2013.01); C04B 2237/407 (2013.01); C04B 2237/56 (2013.01); H05K 3/007 (2013.01); H05K 1/0306 (2013.01); H05K 2203/016 (2013.01); C04B 2237/62 (2013.01); C04B 2237/06 (2013.01); C04B 2237/568 (2013.01);
Abstract
The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.