Munich, Germany

Heiko Gottschling

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Stryker European Operations Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heiko Gottschling. Retrieved from https://idiyas.com/inventor/heiko-gottschling

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Heiko Gottschling, Inventor in Munich

Introduction

Heiko Gottschling is an inventor associated with Munich, Germany, and Stryker European Operations Limited. His patent work concerns methods and devices for reproducing the position and orientation of bone fragments.

Latest Patents

The provided information lists one patent for Gottschling: “Method and device for reproducing position and orientation of (long) bone fragments.” The invention addresses repositioning and reorienting bone fragments, including long bone fragments, with the aim of improving the accuracy of the process. The available information does not establish when this patent was granted or whether it is his latest patent. His listed patent count is 1 patent.

Career Highlights

Gottschling is associated with Stryker European Operations Limited, a company operating in the medical technology sector. His listed invention focuses on a technical challenge in bone-fragment positioning and orientation.

Collaborations

The provided information names Lars Metz and Fabian Huegle as Gottschling’s coworkers. It does not specify whether they collaborated with him on the listed patent.

Conclusion

Heiko Gottschling’s listed patent reflects an innovation aimed at improving the repositioning and reorientation of bone fragments, including long bones.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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