Heiko Feisst

Title: Heiko Feisst: Inventor of Electronic Device Housing Innovations.

Introduction

Heiko Feisst is an inventor based in Oppenweiler, Germany. His work includes inventions for electronic devices, with a focus on printed circuit board assemblies and housing designs. He is associated with Murrelektronik GmbH and holds 2 patents.

Latest Patents

Feisst’s recent patent work includes a printed circuit board assembly for a field bus device. The design places an electronic component against a gap filler on a bearing surface inside the housing, supporting the circuit board through the component and gap filler. A potting compound covers the circuit board and contacts the gap filler.

Another invention, “Housing assembly with all-round visible luminous areas,” describes an electronic-device housing with indicator lights distributed across its sides. When activated, the luminous areas work together to emit signals into at least a hemispherical region around the housing, making the signals visible from multiple directions.

Career Highlights

Feisst’s patent portfolio reflects practical engineering aimed at integrating electronic components, circuit boards, and device housings. His inventions address both the mounting and protection of circuit boards and the visibility of status indicators.

Collaborations

Feisst is associated with Murrelektronik GmbH. His listed coworkers include Tim Roolf and Jan Maier.

Conclusion

Heiko Feisst’s patented work focuses on functional electronic-device design, combining robust circuit board mounting with indicator lighting visible from multiple directions.